TECMA ARIES has successfully concluded its participation in interpack 2026, the world’s leading trade fair for processing and packaging, held in Düsseldorf from May 7 to 13, 2026.

The exhibition was a valuable opportunity to engage with our clients, partners, and suppliers, discuss end‑of‑line challenges, and explore tailored automation solutions. Beyond the technologies presented, these exchanges contributed to strengthening relationships and opening new perspectives for collaboration.

We thank all visitors and partners for their time, their trust, and the quality of the discussions throughout the week.