Event

TECMA ARIES will participate in interpack 2026, the world’s leading trade fair for processing and packaging.

Our teams will be present to discuss end‑of‑line packaging solutions, robotic systems, complete lines, and after‑sales services, including revamping, upgrades, and long‑term technical support.

interpack will be a key opportunity to exchange on industrial performance, operational efficiency, and evolving packaging requirements across industries.

Düsseldorf, Germany
May 7–13, 2026
Hall 6
Stand C59